1. Hole size tolerance
: +/- 0.08 mm (PTH hole)
: +/- 0.05 mm (NPTH hole)
: +0.1/-0.05 mm (Punch hole)
2. Hole location tolerance
: +/- 0.08 mm (Drill hole)
: +/- 0.10 mm (Punch hole)
3. Minimum hole size
: 0.3 mm (T < 1.6mm)
4. Line width tolerance
: +/- 10% (Half oz copper)
: +/- 20% (one oz copper)
5. Line space tolerance
: +/-10% (Half oz copper)
: +/-20% (one oz copper)
6. Minimum line width
: 0.15 mm (one oz copper)
7. Minimum line space
: 0.15 mm (one oz copper)
8. Minimum pad size
: 0.30mm >drill size
9. Outline tolerance (L x W)
: +/- 0.10 mm
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10. Board
thickness
: 0.60mm to 3.2 mm
11. Base copper thickness
: <=3 oz copper (0.004 inches/ 102 micron)
12. Registration
: +/- 0.08 mm
13. Plating thickness
: Copper min. 25 micron (0.001 inches)
: Solder 7~12.5 micron (280~500 micro-inches)
14. Edge connector thickness
: Nickel > 2.5 micron (100 micro-inches)
: Gold 0.01~0.05 micron (flash)
: 0.05 micron or above (per customer request)
15. Wet film Solder mask
: 0.08mm (clearance)
: 0.08mm (coverage)
: i.e. the space between the line to circuit pad to be
0.16mm
16. V-cut location tolerance
: +/- 0.15 mm (V-cut)
: +/- 0.1 mm (CNC V-cut)
17. V-cut remain thickness
: 1/3 of the board thickness +/-0.10mm
18. Bevelling angle
: 30°, 45°, 60°
Detailed Specification will be
provided upon request. |
