1. Hole size tolerance : +/- 0.08 mm (PTH hole)  : +/- 0.05 mm (NPTH hole)  : +0.1/-0.05 mm (Punch hole) 2. Hole location tolerance : +/- 0.08 mm (Drill hole)  : +/- 0.10 mm (Punch hole) 3. Minimum hole size : 0.3 mm (T < 1.6mm) 4. Line width tolerance : +/- 10% (Half oz copper)  : +/- 10% (one oz copper) 5. Line space tolerance : +/-10% (Half oz copper)  : +/-10% (one oz copper) 6. Min. Bonding lead width : 0.12 mm (Half oz copper)  : 0.18 mm (one oz copper) 7. Min. Bonding lead space : 0.10 mm (Half & one oz copper) 8. Minimum line width : 0.08 mm (Half oz copper)  : 0.15 mm (one oz copper) 9. Minimum line space : 0.08 mm (Half & one oz copper)

10. Minimum pad size : diameter 0.30mm >drill size (Dry film & Half oz copper)  : diameter 0.40mm >drill size (Dry film & one oz copper)  : diameter 0.40mm >drill size (silk-screen & Half oz copper)  : diameter 0.50mm >drill size (silk-screen & one oz copper) 11. Outline tolerance (L x W) : +/- 0.10 mm 12. Board thickness : 0.10mm to 3.2 mm  13. Registration : +/- 0.20 mm (Silk-screen)  : +/- 0.08 mm (Dry film) 14. Plating thickness : 4um - 10um (Copper)  : 4um - 9 um (Nickel)  : 0.01um-0.05um (flash gold)  : 0.05um or above (thick gold as per customer request) 15. Printing Solder mask : 0.15mm (clearance)  : 0.15mm (line coverage)  : i.e. the space between the line to circuit pad to be 0.30mm

16. Wet film Solder mask : 0.08mm (clearance)  : 0.08mm (line coverage)   : i.e. the space between the line to circuit pad to be 0.16mm 17. V-cut location tolerance : +/- 0.15 mm (V-cut) : +/- 0.1 mm  (CNC V-cut) 18. Space of Circuitry to edge : 0.30 mm (punch)  : 0.50 mm (V-cut) 19. V-cut remain thickness : 1/3 of the board thickness +/-0.10mm 20. Under cut (for Etching) : Etching factor >= 1  : total 0.02mm (half oz copper single side PCB)  : total 0.03mm (half oz copper double side PCB)  : total 0.02mm (one oz copper single side PCB)  : total 0.04mm (one oz copper double side PCB) 21. Bevelling angle : 30°, 45°, 60° Detailed Specification will be provided upon request.