1.
Board Thickness after Pressing
: min. thickness 0.4mm
: max. thickness 3.2mm
: thickness tolerance ±0.125mm
2. Warp
:SMT Board < 0.75%
Others < 1.5%
3. Min. line width
: 0.1mm
4. Min. spacing
: 0.12mm (half oz Cu)
: 0.15mm (one oz Cu)
: 0.2mm (two oz Cu)
5. Line width and spacing tolerance
: ±20%
6. Min. annular ring
: 0.15mm
7. Min. clearance
: 0.35mm
8. Min. thermal gap
: 0.15mm
9. Inner registration
: 0.05mmOuter Layer
specification will follow the Double sided nickel / gold
and HAL specification. Detailed Specification will be
provided upon request. |
